Project Semiconductor-X
Collaborative project: Initiative for the digitization of supply chains in the semiconductor industry (Semiconductor-X) - Subproject: Vertical integration of manufacturing assets in the Semiconductor-X data space
Project desciption
The “Semiconductor-X” project aims to develop digital twins for the semiconductor industry based on the Gaia-X/Catena-X architecture, which digitally map the planning-critical segment of the supply and value chain. To ensure applicability in the industry, these digital twins are to be based on a generic software architecture that uses parameterizable data and reference models to represent company-specific chains and actively takes into account industry-specific standards such as RosettaNet in addition to Gaia-X and Catena-X components such as Eclipse Dataspace Components (EDC) or Asset Administration Shells (AAS). By using (AI-based) analysis functions, industry-specific challenges such as long production throughput times, fluctuating process yields and a very high number of variants with highly variable input-output relationships are addressed. The HTW Dresden sub-project focuses on the vertical integration of semiconductors in the Resilient Network Nodes application cluster. This lays the foundation for new digital services and cooperation models for optimizing operations and increasing quality in the semiconductor manufacturing process. It creates components for an ecosystem for the digital networking of partners in order to form resilient network nodes that allow semiconductor manufacturers to maintain their operational and delivery capability in crisis situations through the flexible integration of other partners and the targeted use of resources.
Contact
M.Sc. Ingolf Gehrhardt
- Z 902
- +49 351 462 3047
Funding
Project duration
May 2024 - September 2026